BAE Systems wins DARPA contract to develop mixed-signal electronics
Under the $8m contract, BAE Systems FAST Labs research and development team will design and develop wafer-scale technology on a silicon foundry platform in collaboration with programme foundries.
The technology could enable new Department of Defense (DoD) applications, including high capacity, robust communications, radars and precision sensors.
Furthermore, it can lead to solutions that improve situational awareness and survivability for troops.
DARPA created the Technologies for Mixed mode Ultra Scaled Integrated Circuits (T-MUSIC) programme to enable disruptive radio frequency (RF) mixed-mode technologies with the development of RF analogue electronics integrated with advanced digital electronics on the same wafer.
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